Circuit Assembly

Flex Circuit and Printer Head Assembly Adhesives
PRODUCT
DESCRIPTION
VISCOSITY (cps)
Tg – DMA
CURE
Pot Life at 25°C (hrs)

357-346-5

White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance

20,000
60
60 min @ 80 degrees C 3min @ 150 degrees C
72 Hours

357-348

White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance

9,500
50
60 min @ 80 degrees C 5 min @ 150 degrees C
72 Hours
357-284

White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance

110,000
65
40 min @ 80 degrees C 1 min @ 150 degrees C
72 Hours

451-107-4

Low viscosity, electrically insulating die attach adhesive

3,500
50
60 min @ 80 degrees C 15 min @ 120 degrees C
48 Hours
EN-7150
Tan, low viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance, high Tg
15,000
106
30 min @ 110 degrees C
72 Hours
Camera Module Assembly Adhesives for Lens Holder Assembly

 631-28

Designed for lens holder bonding in camera modules can be used for any assembly process requiring UV tack plus thermal cure

27,000
107
UV and/or 15 min @ 110 degrees C
Dispense Stencil Print

 631-39

 Low shrinkage adhesive designed for lens holder bonding and other micro assembly applications

33,000
92
UV and/or 15 min @ 110 degrees C
Dispense Stencil Print

 631-68

Extremely low CTE, low shrinkage adhesive designed for lens holder bonding and other micro assembly applications. High Tg

80,000
140
UV and/or 15 min @ 110 degrees C
Dispense Stencil Print
UV Cure Chip Encapsulants

 451-268

Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications

10,000
112 degrees C
UV and/or 30 min @ 150 degrees C
72 Hours

451-269

Fill material for dam and fill chip encapsulation or cavity fill. Good for smart cards and general circuit assembly applications

2,000
72 degrees C
UV and/or 30 min @ 150 degrees C
73 Hours