Circuit Assembly

Flex Circuit and Printer Head Assembly Adhesives
PRODUCT
DESCRIPTION
VISCOSITY (cps)
Tg – DMA
CURE
Pot Life at 25°C (hrs)
357-348
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
9500
50
60 min @ 800C 5 min @ 1500C
72 Hours
357-346-5
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
20000
60
60 min @ 800C 3 min @ 1500C
72 Hours
357-284
White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance
110000
65
40 min @ 800C 1 min @ 1500C
72 Hours
357-346-5
White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance
20000
60
60 min @ 800C 3 min @ 1500C
72 Hours
EN-7150
Tan, low viscosity adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance, high Tg
15000
106
30 min @ 1100C
72 Hours