Electrically Conductive

PRODUCT
DESCRIPTION
RESISITIVITY (ohm•cm)
Tg (˚C)
Tan Delta
Viscosity cP (5.0 rpm)
Application Method
Electrically Conductive Die Attach Adhesives

 561-147-1

Low cost, moderate Tg, snap cure, low bleed on cell surfaces. 80°C cure capable.

4 x 10-4
90
11,000
Needle, Jet, Screen Print

CA-105

High Tg, low cost die attach for small die and LED’s

3 x 10-4
135
11,000
Dispense

CA-177

Low cost conductive die attach. Good for small die and tantalum capacitors, fast cure

7 x 10-4
93
13,000
Dispense

CA-177-S

Low cost conductive die attach formulated to prevent galvanic corrosion on tin and solder surfaces

1 x 10-3
87
13,000
Dispense
CA-180

Low temperature cure (cured 30 minutes at 800C), snap cure at 1500C plus (10 seconds at 150°C)

6 x 10-3
50
12,000
Dispense

 CA-181

Low temperature cure (cured 60 minutes at 800C), higher Tg than CA-180

2 x 10-4
72
11,000
Dispense

 CA-183

 Low temperature cure (80°C) flexible ECA

9 x 10-4
20
20,000
Dispense

 DA-5845-GB

Chip on board, meets NASA outgassing requirements

2 x 10-4
65
25,000
Dispense

 DA-5100

General purpose chip on board die attach adhesive

5 x 10-4
115
17,000
Dispense
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives

 DA-5933A

High thermal conductivity, ionically clean die attach for power devices and LED’s, 21W/m0K

9.0 x 10-5
107
7,500
Pin transfer Dispense

DA-5990-1

High thermal conductivity, ionically clean die attach for power devices and LED’s, 20W/m0K

5.0 x 10-4
140
10,000
Pin transfer Dispense

 CA-142

 High thermal conductivity, ionically clean, flexible, low stress solution for large die, 10W/m°K

2.0 x 10-4
5
22,000
Dispense

CA-192

 High thermal conductivity, low cost, ionically clean, 20W/m0K

1.0 x 10-4
145
10,000
Pin transfer Dispense

CA-193

High thermal conductivity, flexible, low cost, ionically clean, 20W/m0K

1.0 x 10-4
170
10,000
Pin transfer Dispense