Electrically Conductive

 
PRODUCT
DESCRIPTION
RESISITIVITY (ohm•cm)
Tg (˚C)
Tan Delta
Viscosity cP (5.0 rpm)
Application Method
Electrically Conductive Die Attach Adhesives
CA-105
High Tg, low cost die attach for small die and LED’s
3 x 10-4
135
11000
Dispense
DA-5845-GB
Chip on board, meets NASA outgassing requirements
2 x 10-4
65
25000
Dispense
DA-5100
General purpose chip on board die attach adhesive
5 x 10-4
115
17000
Dispense
DB-1568
Low temperature cure (90% cured 30 minutes at 800C), snap cure at 1500C plus
5 x 10-4
40
25000
Stencil print
CA-180
Low temperature cure ( cured 15 minutes at 800C), snap cure at 1500C plus (2 seconds @ 2000C)
6 x 10-5
50
12000
Dispense
High Thermal Conductivity, Electrically Conductive Die Attach Adhesives
CA-190
High thermal conductivity (20W/mK), ionically clean, long open time die attach for small die and LED
5.0 x 10-5
135
11000
Pin transfer Dispense
CA-195
Low cost, High thermal conductivity (15W/mK), ionically clean, long open time die attach for small die and LED
6.0 x 10-5
135
11000
Pin transfer Dispense
DA-5045-2
High thermal conductivity (20W/m0K) die attach for LED’s and small die
1.0 x 10-4
139
10500
Pin transfer Dispense
DA-5933A
High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s
9.0 x 10-5
107
7500
Pin transfer Dispense