COB Encapsulants

TYPICAL APPLICATIONS
PRODUCTS
  • COB   • One Component Silicone
    • One Component Epoxy
PRODUCT
DESCRIPTION
VISCOSITY
Tg-DMA
CURE SCHEDULE
Pot Life at 25°C (hrs)

EN-7826

Glob top encapsulant.  User friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief.  CTE = 18ppm below Tg

Controlled flow, domed appearance

140 °C
30 min at 150 °C
>48 Hrs

 EN-7826FF

 Fine filler version of EN-7826 for encapsulating fine pitch wirebonds


33,000
155 °C
20 min at 150 °C
>48 Hrs

DE-7826

Dam fill material.  Matches cavity properties.  User friendly pot life (>2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg


Smooth thixotropic paste

140 °C
30 min at 150 °C
>48 Hrs

CE-7826


Cavity fill material.  Matches dam properties.  Excellent flow properties, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg


Self leveling liquid


140 °C
30 min at 150 °C
>48 Hrs

CE-7510-S

Silicone cavity fill material.  Matches dam properties.  Excellent flow properties, room temperature stable, excellent adhesion and very good tear properties.

750
-121 °C
30 min at 150 °C
3 months
UV Cure Chip Encapsulants

 451-268

Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications

10,000
132 °C
UV and/or 30 min at 150 °C
72 hours

451-269

Fill material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications

2,000
72 °C
UV and/or 30 min at 150 °C
73 hours