COB Encapsulants

TYPICAL APPLICATIONS
PRODUCTS
  • COB   • One Component Silicone
    • One Component Epoxy
PRODUCT
DESCRIPTION
VISCOSITY
Tg
CURE SCHEDULE
Shelf Life
400-30
Fast curing low viscosity glob top
30,000 cps
145 °C
3 min at 160 °C
4 months @ 25 °C
500-98
UV curable C.O.B. with good adhesion to FR-4
6,000 cps
N/A
20 sec with UV
6 months @ <25 °C
704-78
Fast curing low viscosity glob top
25,000 cps
145 °C
3 min at 160 °C
4 months @ 25 °C
408-14
General C.O.B. with high dot height
70,000 cps
142 °C
20 min at 160 °C
3 months @ 0 °C
EN 7826
High performance encapsulant with low CTE
(18 ppm)
95,000 cps
140 °C
30 min at 150 °C
6 months @ -40 °C
EN 7500 S
RT stable C.O.B. silicone with excellent adhesion
28,000 cps
-121 °C
310 min at 150 °C
3 months @ 25 °C