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LED Assembly

TYPICAL APPLICATIONS
PRODUCTS
Excellent Thermal Resistance High Thermally-Conductive
Silver Filled
Electrically-Conductive Transparent, UV Resistant
UV Resistant
PRODUCT
DESCRIPTION
Resistivity (ohm•cm)
Tg (°C) Tan Delta
Viscosity cP (5.9 rpm)
Application Method
High Thermal Conductivity, Electrically Conductive LED Die Attach Adhesives

CA-105

High Tg, low cost die attach for small die and LED’s

3 x 10-4
135
11,000
Dispense

CA-190-2


High thermal conductivity, low cost


Dispense

CA-190-3

High thermal conductivity, flexible, low cost 10 W/mK

Dispense

DA-5933A

High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s

9.0 x 10-5
107
7,500
Pin transfer Dispense

DA-5990-1

High thermal conductivity (20W/m0K), ionically clean die attach for power devices and LED’s

5.0 x 10-4
140
10,000
Pin transfer Dispense
Transparent LED die attach/encapsulants

DA-5887-9

Transparent epoxy adhesive designed for LED die attach or encapsulation

12,000
134
30 min @ 150°C
0.3

DA-5898

Transparent epoxy adhesive designed for LED die attach or encapsulation

9,000
70
30 min @ 150°C
0.3