LED Assembly

TYPICAL APPLICATIONS
PRODUCTS
 Excellent Thermal Resistance • High Thermally-Conductive
Silver Filled
 Electrically-Conductive  Transparent, UV Resistant
 UV Resistant
PRODUCT
DESCRIPTION
VISCOSITY (cps)
5.0 rpm
Tg (°C)
CURE
Electrical Conductivity (ohm•cm)
DA-5933-A
Outstanding thermal dissipation for die attach and high power LED; 20 W/mK
7,500
135
60 min @ 175°C
9 x 10-5
DA-5887-H
Non-conductive, transparent, optically-clear material that withstands UV and blue light
8,500
110
45 min @ 175°C
1 x 1014
DA-5055
Stencil/screen printable conductive adhesion for LED display
40,000
35
10 min @ 120°C
5 x 10-4
DA-5045
High thermal conductivity for LED attach; Rapid, low temp cure and UV resistant; 20 W/mK
10,500
58
15 min at 150°C
8 x 10-5
DA-5044
Snap cure with good stability and low temperature cure capabilities
10,000
35
1 min @ 175°C
10 min @ 120°C
5 x 10-4
DA-5041
Snap cure for chip on board, LED and small die semiconductor applications
8,500
30
3 min @ 175°C
30 min @ 150°C
2 x 10-4
DA-5011
Non-conductive, transparent, optically-clear, snap cure, material that withstands UV and blue light
8,000
80
2 min @ 120°C
1 x 1014