LED Assembly

TYPICAL APPLICATIONS
PRODUCTS
 Excellent Thermal Resistance • High Thermally-Conductive
Silver Filled
 Electrically-Conductive  Transparent, UV Resistant
 UV Resistant
PRODUCT
DESCRIPTION
Resistivity (ohm•cm)
Tg (°C) Tan Delta
Viscosity cP (5.9 rpm)
Application Method
High Thermal Conductivity, Electrically Conductive LED Die Attach Adhesives

CA-105

High Tg, low cost die attach for small die and LED’s

3 x 10-4
135
11,000
Dispense

CA-190-2


 High thermal conductivity, low cost


Dispense

CA-190-3

High thermal conductivity, flexible, low cost  10 W/mK

Dispense

 DA-5933A

High thermal conductivity (21W/m0K), ionically clean die attach for power devices and LED’s

9.0 x 10-5
107
7,500
Pin transfer Dispense

DA-5990-1

High thermal conductivity (20W/m0K), ionically clean die attach for power devices and LED’s

5.0 x 10-4
140
10,000
Pin transfer Dispense
Transparent LED die attach/encapsulants

 DA-5887-9

 Transparent epoxy adhesive designed for LED die attach or encapsulation

12,000
134
30 min @ 150°C
0.3

 DA-5898

 Transparent epoxy adhesive designed for LED die attach or encapsulation

9,000
70
30 min @ 150°C
0.3