Thermally Conductive

TYPICAL APPLICATIONS
PRODUCTS
• Heat Sink  One Component Epoxy
• Lid Seal  B-Stage Materials
• Heat Dissipation  Thermal Greases
PRODUCT
DESCRIPTION
VISCOSITY (cps)
5.0 rpm
Tg (°C)
CURE
Thermal Conductivity (W/m•K)
DA-5933-A
Outstanding thermal dissipation for die attach and high power LED
7,500
135
60 min @ 175°C
20
TM-6700
Non-bleed, high temperature stable, high thermal conductivity grease
100,000

4.5
TM-6400
Two-component, 1:1 by volume low viscosity potting compound
40,000
190
120 min @ 180°C
2.0
TM-6205
Electrically-insulating, multipurpose paste adhesive with good viscosity stability
100,000
110
10 min @ 150°C
1.4
TM-6160
Low viscosity, electrically insulating adhesive for semi-conductor applications
7,000
95
45 min @ 125°C
2.0