UV Cure Assembly

Product
Description
Viscosity (cps)
Tg – DMA ( 0C)
Cure
Thermal Conductivity W/m0K
UV
Cure Assembly Adhesives and Encapsulants
535-32 Low viscosity epoxy adhesive/encapsulant, contains
secondary thermal cure
1,200 2 UV + 20 min @ 1100C 0.3
535-10M-1 High viscosity epoxy
adhesive/encapsulant, contains secondary thermal cure
400,000 5 UV + 20 min @ 1100C 0.3
535-18M-57 Medium viscosity with faster cure speed 75,000 5 UV 0.3