UV Cure Assembly

Product
Description
Viscosity (cps)
Tg – DMA ( 0C)
Cure
Thermal Conductivity W/m0K
UV Cure Assembly Adhesives and Encapsulants
535-32 Low viscosity epoxy adhesive/encapsulant, contains secondary thermal cure 1,200 2 UV + 20 min @ 1100C 0.3
 535-11M-7  Dispensible epoxy adhesive/encapsulant, contains secondary thermal cure 12,000 5 UV + 20 min @ 1100C 0.3
 535-18M-62 Medium viscosity developed for damping  and general adhesive applications 75,000 30 UV 0.3
 UV-9108  UV cured acrylate, low viscosity, rapid cure, good adhesion to PVC, polycarbonate 1,400 40 UV 0.3
UV Cure Chip Encapsulants
 451-268 Dam material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications 10,000 1120C UV and/or 30 min @ 1500C 72 hours
451-269 Fill material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications 2,000 720C UV and/or 30 min @ 1100C 73 hours
Camera Module Assembly Adhesives for Lens Holder Assembly
 631-28 Designed for lens holder bonding in camera modules can be used for any assembly process requiring UV tack plus thermal cure 27,000 107 UV and/or 15 min @ 1100C Dispense Stencil Print
 631-39  Low shrinkage adhesive designed for lens holder bonding and other micro assembly applications 33,000 92 UV and/or 15 min @ 1100C Dispense Stencil Print
 631-68 Extremely low CTE, low shrinkage adhesive designed for lens holder bonding and other micro assembly applications. High Tg 80,000 140 UV and/or 15 min @ 1100C Dispense Stencil Print