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Dry Film Photoresist

EMS Dry Films exhibit excellent hydrophobicity and chemical resistance, excellent tenting properties, exceptional resolution, and good adhesion to a variety of substrates. They find use in permanent MEMS applications and some etch applications where high aspect ratio/resolutions is required. Contact EMS for more details.

Resist Series/ Property

DF-1000 Series Film

DF-2000 Series Film

DF-3000 Series Film

DF-3500 Series Film

DF-4000 Series Film

Material Overview

For higher aspect ratio films.

Better batch to batch photospeed

Lower stress film

 

Non-Sb version of DF-2000 series

 

Hydrophobic surface, high contact angle film

Glass Transition Temperature, DMA TanD, °C

180

180

120

180

180

H2O Contact Angle, 23°C

73°

72°

74°

74°

95°

Observed Color, After PEB

Clear

Green

Tan

Green

Green

Minimum Resolution, 20µ film

4-5µ

Maximum Aspect Ratio, 20µ film

8:1

8:1

5:1

8:1

8:1

Thickness’ Available

5-100µ

5-50µ

 

5-75µ

 

5-75µ

14 and 17µ

 

UV Cure E, Contact Imaging, mJ/cm2, 20µ film

175

90

120

 

150

 

90

 

UV Chemistry

Sb

Sb

Non-Sb

 

Non-Sb

Sb, hydrophobic dual layer coating

25°C, 8 week soak, % Uptake: H2O, Xylene, IPA, MEK, DMSO

<0.25%

<0.25%

<0.25%

 

<0.25%

 

<0.25%

Dry film
Dry film

*Typical Film Stack

Dry film

* Ability to tent across 750µ channels