Solar Back Contact

Product Description Resistivity (ohm•cm) Tg (˚C)
Tan Delta

Viscosity cP (5.0 s-1) Application Method
Conductive
Adhesives for Back Contact Applications
CA-150-H Low cost, low Tg, snap cure, low bleed on cell surfaces. Recommended for stringing or shingling 5 x 10-4 -10 25,000 Stencil Print
DB-1588-4 Lowest cost of the DB-1588-series materials. Faster cure for fast cure EVA encapsulants 2 x 10-4 0 35,000 Stencil Print
DB-1588-6 Lowest cost, flexible, excellent damp heat performance on OSP treated copper. 4 x 10-4 5 10,000 Dispense Jet
FE-106 Low cost, flexible, excellent damp heat performance on OSP treated copper. Formulated for Formula E manufacturing lines 4 x 10-4 4 11,000 Dispense Jet