Solar Back Contact

Product Description Resistivity (ohm•cm) Tg (˚C)
Tan Delta

Viscosity cP (5.0 s-1) Application Method
Conductive
Adhesives for Back Contact Applications
DB-1541 Flexible, high peel strength, Damp heat stability
on tin and OSP treated copper. Designed to cure during EVA lamination
1 x 10-4 13 33,000 Stencil Print
DB-1588-1 Lowest cost, flexible, excellent damp heat
performance on OSP treated copper.
4 x 10-4 5 30,000 Stencil Print
DB-1588-2 Low cost, flexible, excellent damp heat performance
on OSP treated copper. Lowest cost.
4 x 10-4 5 30,000 Stencil Print
DB-1588-3 Needle dispensible or jet version of DB-1588-4 2 x 10-4 0 20,000 Needle Dispense, Jet
DB-1588-4 Lowest cost of the DB-1588-series materials. Faster
cure for fast cure EVA encapsulants
2 x 10-4 0 35,000 Stencil Print
DB-1588-5 Slower cure for longer laminations 2 x 10-4 0 35,000 Stencil Print
DB-1588-6 Designed for jet or needle dispensing 3 x 10-4 -15 11,000 Jet Dispensing