|
Product
|
Description
|
Viscosity (cps)
|
Tg - DMA
|
Cure
|
Pot Life at 25°C (hrs)
|
Status
|
| Chip on Board Encapsulants | ||||||
| EN-7826 | Glob top encapsulant. User friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 65,000 Controlled flow domed appearance | 140⁰C | 30 min @ 1500C | >48 | Commercial |
| DE-7826 | Dam fill material. Matches cavity properties. User friendly pot life (>2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 200,000 | 140 °C | 30 min @ 1500C | >48 | Commercial |
| CE-7826 | Cavity fill material. Matches dam properties. Excellent flow properties, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 40,000 | 140 °C | 30 min @ 1500C | >48 | Commercial |
| UV Cure Adhesives and Chip Encapsulants | ||||||
| 535-10M-1 | Hi viscosity elastomeric adhesive for applications requiring extremely low warpage and stress | 400,000 | 5 ⁰C | UV and/or 30 min @ 120°C | 72 | Commercial |
| DC-4261 | Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 10,000 | 112 °C | UV and/or 30 min @ 150°C | 72 | Commercial |
| DC-4262 | Fill material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 2,000 | 72 °C | UV and/or 30 min @ 150°C | 73 | Commercial |
| EC-9519 | Clear flexible UV cure encapsulant / adhesive | 4,000 | NT | UV | 0.3 | Commercial |
| Flex Circuit / Printer Head Assembly Adhesives and non-conductive die atach | ||||||
| DA-5801 | White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance | 20,000 | 60 | 60 min @ 800C 3 min @ 1500C | 72 | Commercial |
| 357-284 | White, high thixotropy adhesive, encapsulant, bonding FR4 to kapton and stainless steel high fracture toughness, high ink and moisture resistance | 110,000 | 65 | 40 min @ 800C 1 min @ 1500C | 72 | Commercial |
| 357-348 | White, low viscosity adhesive, encapsulant, bonding FR4 to kapton, high fracture toughness, high ink and moisture resistance | 9,500 | 50 | 60 min @ 800C 5 min @ 1500C | 72 | Commercial |
| 332-5-122 | Moderate Tg, hydrophobic, high strength adhesive for circuit assembly and printer head assemblies. Can withstand harsh environments, solvent resistant | 25,000 | 106 (ARES) | 30 min @ 1200C | 72 | Commercial |
| EN-7930 | Low viscosity, electrically insulating die attach adhesive | 3,500 | 50 | 60 min @ 800C 15 min @ 120°C | 48 | Commercial |
| Camera Module Assembly Adhesives for Lens Holder Assembly | ||||||
| 631-210 | High Tg, low CTE (15ppm), dimensionally stable dual cure for photonic, camera module and general electronics assembly applications | 36,000 | 155 (ARES) | UV and/or 60 min @ 120°C | 24 | Developmental |