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PRODUCT
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DESCRIPTION
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VISCOSITY
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Tg-DMA
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CURE SCHEDULE
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Pot Life at 25°C (hrs)
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EN-7826 |
Glob top encapsulant. User friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg |
Controlled flow, domed appearance |
140 °C
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30 min at 150 °C
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>48 Hrs
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EN-7826FF |
Fine filler version of EN-7826 for encapsulating fine pitch wirebonds
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33,000
|
155 °C
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20 min at 150 °C
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>48 Hrs
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DE-7826 |
Dam fill material. Matches cavity properties. User friendly pot life (>2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg
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Smooth thixotropic paste |
140 °C
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30 min at 150 °C
|
>48 Hrs
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CE-7826
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Cavity fill material. Matches dam properties. Excellent flow properties, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg
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Self leveling liquid
|
140 °C
|
30 min at 150 °C
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>48 Hrs
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CE-7510-S |
Silicone cavity fill material. Matches dam properties. Excellent flow properties, room temperature stable, excellent adhesion and very good tear properties. |
750
|
-121 °C
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30 min at 150 °C
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3 months
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| UV Cure Chip Encapsulants | ||||||||||||||||||
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451-268 |
Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications |
10,000
|
132 °C
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UV and/or 30 min at 150 °C
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72 hours
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451-269 |
Fill material for danm and fill chip encapsulation. Good for smart cards and general circuit assembly applications |
2,000
|
72 °C
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UV and/or 30 min at 150 °C
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73 hours
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