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Product
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Description
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Viscosity (cps)
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Tg - DMA
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Cure
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Pot Life at 25°C (hrs)
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Status
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| Chip on Board Encapsulants | ||||||
| EN-7826 | Glob top encapsulant. User friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 65,000 Controlled flow domed appearance | 140 ⁰C | 30 min @ 1500C | >48 | Commercial |
| DE-7826 | Dam fill material. Matches cavity properties. User friendly pot life (>2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 200,000 | 140 ⁰C | 30 min @ 1500C | >48 | Commercial |
| CE-7826 | Cavity fill material. Matches dam properties. Excellent flow properties, user friendly pot life (> 2 days), superior environmental protection with enhanced moisture resistance and internal stress relief. CTE = 18ppm below Tg | 40,000 | 140 ⁰C | 30 min @ 1500C | >48 | Commercial |
| UV Cure Chip Encapsulants | ||||||
| DC-4261 | Dam material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 10,000 | 112 °C | UV and/or 30 min @ 150°C | 72 | Commercial |
| DC-4262 | Fill material for dam and fill chip encapsulation. Good for smart cards and general circuit assembly applications | 2,000 | 72 °C | UV and/or 30 min @ 150°C | 73 | Commercial |