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PRODUCT
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DESCRIPTION
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RESISITIVITY (ohm•cm)
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Tg (˚C)
Tan Delta |
Viscosity cP (5.0 rpm)
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Thermal Conductivity W/m⁰K
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Application Method
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Status
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|
Electrically Conductive Die and Component Attach Adhesives
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|||||||
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561-147-1 |
Low cost, moderate Tg, snap cure |
4 x 10-4
|
90
|
11,000
|
N/A
|
Needle, Jet, Screen Print
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Commercial
|
|
CA-152 |
Low cost, flexible ECA, acrylate |
4 x 10-4
|
14
|
18,000
|
N/A
|
Needle, Jet, Screen Print
|
Developmental
|
|
CA-183 |
Low cost, Low temperature cure (80°C) flexible ECA |
9 x 10-4
|
20
|
17,000
|
N/A
|
Dispense
|
Developmental
|
|
CA-178 |
Electrically conductive die attach adhesive |
1.5 x 10-4
|
97
|
13,000
|
N/A
|
Dispense
|
Commercial
|
|
High Thermal Conductivity, Electrically Conductive Die and Component Attach Adhesives
|
|||||||
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CA-146 |
High thermal conductivity, flexible die attach for power devices, large die |
5.0 x 10 -5
|
20
|
14,000
|
10
|
Pin transfer Dispense
|
Developmental
|
|
CA-188-2 |
High thermal conductivity, low temperature cure (80⁰C), low stress solution |
7.0 x 10 -4
|
62
|
17,000
|
5
|
Dispense, Jet
|
Developmental
|
|
CA-191 |
High thermal conductivity, power devices, small die, LED's, light stable |
5.0 x 10 -5
|
136
|
10,000
|
25
|
Pin transfer Dispense
|
Developmental
|
|
DA-5990-1 |
High thermal conductivity die attach for power devices and LED's |
5.0 x 10 -4
|
140
|
10,000
|
20
|
Pin transfer Dispense
|
Commercial
|
|
DB-1588-7 |
High thermal conductivity, flexible, low cost |
4.0 x 10 -4
|
7
|
35,000
|
6
|
Stencil Print
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Commercial
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