Camera Module Assembly Adhesives for Lens Holder Assembly
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Product
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Description
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Resistivity (ohm•cm)
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Tg (˚C)
Tan Delta |
Viscosity cP (5.0 s-1)
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Application Method
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Status
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| Conductive Adhesives for Tabbing Back Contact Cells | ||||||
| CA-151 | Low cost, low Tg, snap cure, low bleed on cell surfaces. Recommended for stringing or shingling, epoxy based | 5 x 10 -4 | -10 | 10,000 | Needle, jet, screen print | Developmental |
| CA-152 | Low cost, low Tg, snap cure, low bleed on cell surfaces. Recommended for stringing or shingling, acrylate based | 5 x 10 -4 | -10 | 15,000 | Needle, jet, screen print | Developmental |
| CA-183 | Low temperature cure (as low as 80C) for organic PV and other temperature sensitive modules, flexible | 9 x 10 -4 | 21 | 26,000 | Stencil Print | Developmental |
| Conductive Adhesives for Back Contact Applications | ||||||
| DB-1588-3 | Low cost. Faster cure for fast cure EVA encapsulants, dispensible version of DB-1588-4 | 2 x 10 -4 | 5 | 20,000 | Dispense, Jet | Developmental |
| DB-1588-4 | Low cost. Faster cure for fast cure EVA encapsulants. Excellent damp heat performance on OSP treated copper | 2 x 10 -4 | 0 | 35,000 | Stencil Print | Commercial |
| DB-1588-7 | Lowest cost, flexible, excellent damp heat performance on OSP treated copper. Lower cost version of DB-1588-4 | 4 x 10 -4 | 7 | 35,000 | Stencil Print | Commercial |